A thermal-materials brand of NGIC — National Graphene Innovation Center
Lenecold is a graphene thermal pad manufacturer and supplier based in Ningbo, China. We build vertically-oriented graphene thermal interface materials that move heat where silicon can't — supplying OEMs, cold plate makers and distributors worldwide, from AI server racks to satellites in low earth orbit.
Lenecold's vertically-oriented graphene structure delivers continuous through-plane heat conduction. Pick the form factor that matches your thermal challenge — interface pad or structural plate.
For high-power electronics: data center CPUs/GPUs, SiP and IGBT power modules, EV battery packs, smart cockpit domain controllers. Replaces thermal grease with a solid, pump-out-free solution.
Ultra-high conductivity structural plate for next-generation comms & aerospace: 6G mmWave base stations, satellite payloads & in-orbit compute, UAV and eVTOL avionics. Easy to cut, drill and surface-finish.
The breakthrough is structural: our graphene flakes stand on edge, forming an unbroken through-thickness thermal network. Heat moves straight from chip to spreader — no in-plane detour, no thermal bottlenecks.
Gravity-aligned graphene creates a straight heat channel through the material's thickness — no in-plane loss, no dead zones.
Less than 10% drift in thermal resistance and compressibility after 1,500 hours at 150°C — proven in-house, validated for production.
Unlike thermal grease, Lenecold pads stay put — no pump-out, no dry-out, no contamination of optical surfaces or surrounding electronics.
Pads from 0.3 to 0.7 mm standard; plates supplied as blanks or finished parts. Custom die-cuts, surface composites and metal-clad stacks on request.
From a single AI accelerator socket to a satellite in low earth orbit — Lenecold covers the operating envelope of modern electronics.
From a single AI accelerator socket to a satellite in low earth orbit — Lenecold covers the operating envelope of modern electronics.
Selection guides, resistance calculations and failure analysis — written for engineers specifying TIM in high-power electronics, not to sell a material.
Power density, gap, mounting pressure and service life — four variables that decide every interface, with worked examples.
Read →Why grease wins on day one and loses by year three — with calculated resistance at real bond lines.
Read →R = L/(k×A), contact resistance terms, and the five mistakes that make first-pass budgets wrong.
Read →Why TIM2 is the largest controllable resistance in a liquid-cooled AI rack — worked 800 W budget.
Read →Power cycling, 150 °C continuous operation and how interface resistance maps to cycle life.
Read →Gap variation, cell swelling, fast-charge flux and cell-to-cell temperature uniformity.
Read →Lenecold is the thermal-materials brand of NGIC — the National Graphene Innovation Center in Ningbo. We manufacture rather than broker: the graphene is produced within our own group, which is why we can supply consistent batch-to-batch material at production volume and support qualification testing with our own data.
We supply thermal pad manufacturers' and cold plate builders' complementary needs — die-cut parts to your drawing, resistance-versus-pressure curves, and aging data at your operating temperature. See supply details →
Lenecold is the graphene thermal-materials brand of NGIC. We our processes benefit from NGIC's national-level R&D infrastructure, an academic team led by leading materials scientists, and a 1,000+ patent portfolio covering graphene synthesis, densification and surface engineering.
Send us your thermal challenge — heat load, footprint, mounting pressure, ambient range. Our applications team will propose a graphene-grade spec within one business day and ship sample material for evaluation.
Request a Quote →