180 W/m·K is a through-plane number measured across the thickness of the pad — the direction heat actually travels. That distinction is the whole point: most high-conductivity sheets on the market quote in-plane figures, which do not help you move heat from a die into a heatsink.
Specification
| Property | Value | Test condition / note |
|---|---|---|
| Through-plane thermal conductivity | 180 W/m·K | Direction of heat flow in a TIM application |
| Thermal resistance | < 0.05 °C·cm²/W | ASTM D5470, at low mounting pressure |
| Long-term stability | 150 °C × 1500 h | Resistance drift ≤ 10%, compressibility drift ≤ 10% @ 50 psi |
| Standard thicknesses | 0.3 / 0.5 / 0.7 mm | Custom 0.2–2.0 mm available |
| Standard sheet size | 150 × 150 mm | Die-cut to drawing, including holes and slots |
| Form | Solid pad | No pump-out, no dry-out, no oil bleed |
| Manufacturer | NGIC, Ningbo | National Graphene Innovation Center |
What 180 W/m·K buys you at a real bond line
| Bond line | 3 W/m·K pad | 6 W/m·K pad | 180 W/m·K pad |
|---|---|---|---|
| 0.3 mm | 0.100 | 0.050 | 0.0017 |
| 0.5 mm | 0.167 | 0.083 | 0.0028 |
| 0.7 mm | 0.233 | 0.117 | 0.0039 |
| 1.0 mm | 0.333 | 0.167 | 0.0056 |
Bulk thermal resistance in °C·cm²/W. Excludes contact resistance, which depends on surface finish and pressure.
The practical consequence: at 0.5 mm the graphene pad has roughly 60× less bulk resistance than a 3 W/m·K pad. You can spend that on thermal headroom, or on opening up your mechanical tolerance so the assembly is easier and cheaper to build.
Is 180 W/m·K more than you need?
If your bond line is thin, your flux is low and your pressure is high, yes — a cheaper pad will do. The number earns its place when the gap is thick, the pressure is limited, or the flux is high: GPU cold plates, power module baseplates, battery cold plates. See the selection guide for the trade-off.
Where it is used
- AI servers and accelerators — TIM2 between lid and cold plate, where bond lines of 0.5–1.0 mm are normal. Details →
- EV traction inverters and SiC modules — baseplate to heatsink, surviving power cycling. Details →
- Battery packs and ESS — cell to cold plate, with swelling tolerance. Details →
- 5G radio units — PA to housing in sealed passive enclosures. Details →
- Mini-LED and fine-pitch displays — thickness-controlled die-cut parts. Details →
Request samples or a quote
Tell us thickness, footprint, volume and target thermal resistance. Samples ship in 7 business days; production in 3–4 weeks. Contact engineering →
Frequently asked questions
Is 180 W/m·K in-plane or through-plane?
Through-plane — measured across the thickness, in the direction heat flows from a die to a heatsink. Many graphene and graphite sheets quote in-plane conductivity, which is useful for spreading heat sideways but not for crossing a gap.
How was the thermal resistance tested?
Per ASTM D5470, the standard steady-state method for thermal interface materials. We are happy to share the test report and, more usefully, to send you a sample so you can measure it in your own fixture.
What thicknesses can I order?
0.3, 0.5 and 0.7 mm are standard. Custom thicknesses from 0.2 to 2.0 mm, die-cut to your drawing with holes and slots as needed.
What is the minimum order for a custom size?
Samples have no minimum — we cut to your drawing and ship in 7 business days. Custom production runs start from 50 pieces; lead time 3–4 weeks.