A thermal-materials brand of NGIC — National Graphene Innovation Center
Lenecold is a graphene thermal pad manufacturer and supplier based in Ningbo, China. We build vertically-oriented graphene thermal interface materials that move heat where silicon can't — supplying OEMs, cold plate makers and distributors worldwide, from AI server racks to satellites in low earth orbit.
Lenecold's vertically-oriented graphene structure delivers continuous through-plane heat conduction. Pick the form factor that matches your thermal challenge — interface pad or structural plate.
For high-power electronics: data center CPUs/GPUs, SiP and IGBT power modules, EV battery packs, smart cockpit domain controllers. Replaces thermal grease with a solid, pump-out-free solution.
Ultra-high conductivity structural plate for next-generation comms & aerospace: 6G mmWave base stations, satellite payloads & in-orbit compute, UAV and eVTOL avionics. Easy to cut, drill and surface-finish.
The breakthrough is structural: our graphene flakes stand on edge, forming an unbroken through-thickness thermal network. Heat moves straight from chip to spreader — no in-plane detour, no thermal bottlenecks.
Gravity-aligned graphene creates a straight heat channel through the material's thickness — no in-plane loss, no dead zones.
Less than 10% drift in thermal resistance and compressibility after 1,500 hours at 150°C — proven in-house, validated for production.
Unlike thermal grease, Lenecold pads stay put — no pump-out, no dry-out, no contamination of optical surfaces or surrounding electronics.
Pads from 0.3 to 0.7 mm standard; plates supplied as blanks or finished parts. Custom die-cuts, surface composites and metal-clad stacks on request.
From a single AI accelerator socket to a satellite in low earth orbit — Lenecold covers the operating envelope of modern electronics.
From a single AI accelerator socket to a satellite in low earth orbit — Lenecold covers the operating envelope of modern electronics.
Customer names are withheld. The conditions and outcomes below come from production and qualification programmes.
A 0.5 mm pad on a 700 W accelerator cold plate held the die-to-cold-plate interface below 5 °C at 50 psi — sustained boost clocks instead of periodic throttling.
A pad-plus-plate stack on a 1,200 V module kept bulk resistance and thickness within 10% after 1,500 h at 150 °C, where grease-based interfaces migrate and dry out.
Replacing copper spreaders with 1.5–4 g/cm³ graphene plate removed 0.5–2 kg from an eVTOL electronics pack — worth roughly 5–15 minutes of extra flight time.
Selection guides, resistance calculations and failure analysis — written for engineers specifying TIM in high-power electronics, not to sell a material.
Power density, gap, mounting pressure and service life — four variables that decide every interface, with worked examples.
Read →Why grease wins on day one and loses by year three — with calculated resistance at real bond lines.
Read →R = L/(k×A), contact resistance terms, and the five mistakes that make first-pass budgets wrong.
Read →Why TIM2 is the largest controllable resistance in a liquid-cooled AI rack — worked 800 W budget.
Read →Power cycling, 150 °C continuous operation and how interface resistance maps to cycle life.
Read →Gap variation, cell swelling, fast-charge flux and cell-to-cell temperature uniformity.
Read →Lenecold is the thermal-materials brand of NGIC — the National Graphene Innovation Center in Ningbo. We manufacture rather than broker: the graphene is produced within our own group, which is why we can supply consistent batch-to-batch material at production volume and support qualification testing with our own data.
We supply thermal pad manufacturers' and cold plate builders' complementary needs — die-cut parts to your drawing, resistance-versus-pressure curves, and aging data at your operating temperature. See supply details →
Lenecold is the graphene thermal-materials brand of NGIC. We our processes benefit from NGIC's national-level R&D infrastructure, an academic team led by leading materials scientists, and a 1,000+ patent portfolio covering graphene synthesis, densification and surface engineering.
No forms, no gatekeeping. Send the stack conditions and we come back with a material, a thickness and a sample.
Power, gap, mounting pressure, duty cycle and lifetime target. A drawing or STEP file helps but is not required.
Material, thickness and stack recommendation with the resistance budget — including when a cheaper option is the right answer.
Die-cut or machined to your drawing, shipped with test data. One piece minimum, no tooling charge for standard thickness.
Batch CoA, dimensional report and full test data on request. Standard lead time 2 weeks; custom geometries 4–6 weeks.
Send us your thermal challenge — heat load, footprint, mounting pressure, ambient range. Our applications team will propose a graphene-grade spec within one business day and ship sample material for evaluation.
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