ASTM D5470 is the standard steady-state method for measuring the thermal resistance of thin thermally conductive materials. If you are comparing TIM data sheets, understanding this one test will save you from most of the ways those numbers mislead.
How the test works
The sample is placed between two meter bars of known conductivity, usually copper. Heat flows from a heater through one bar, across the sample, into the second bar and out to a cooling block. Thermocouples along the bars give the temperature gradient, from which heat flux and the temperature drop across the sample are derived. The whole stack sits under a controlled, variable compressive load.
Four numbers to demand from any data sheet
The pressure
Thermal resistance falls as pressure rises. A figure quoted at 100 psi is not comparable to one at 10 psi. If pressure is not stated, the number is close to meaningless.
The bond line thickness
Resistance scales with thickness. A value quoted at 0.1 mm says nothing useful about performance at 0.8 mm.
Whether contact resistance is included
Some reports subtract it, some include it. In a real joint you always pay it.
The aged value
Day-one resistance is easy. Resistance after 1,000 hours at operating temperature, under load, is the number that predicts field performance.
What we report
| Item | Lenecold reporting |
|---|---|
| Method | ASTM D5470 |
| Thermal resistance | < 0.05 °C·cm²/W, at low mounting pressure |
| Curve data | Resistance vs pressure, for 0.3 / 0.5 / 0.7 mm |
| Aging | 150 °C × 1500 h @ 50 psi, resistance drift ≤ 10%, compressibility drift ≤ 10% |
| Samples | Cut to your footprint so you can measure it in your own fixture |
